
Thermally debonding tape is also known as thermally debonding tape. When the tape is attached to the bonded object, it has good bonding strength, but after heating, the viscosity will decline with the increase of temperature and then fail, and it can be easily removed. It is mainly used to protect the production process of precision glass, hardware, circuit boards, precision ceramics, and wafer chips to facilitate operation and improve yield.
Thickness: 80um-150um
Width: can be customized
Length: can be customized