
The product is semi-cured by coating the acrylic/epoxy resin adhesive on the carrier. According to the thickness of the applied adhesive layer, a variety of products with different specifications can be produced.
It is used as an intermediate bonding layer when reinforcing and laminating multi-layer circuit boards. It has good temperature resistance and peel strength, which is convenient for operation.
Thickness: 12.5um, 25um, 35um, 40±3um
Width: 250mm, 500mm
Length: 200m