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    Pure film

    Pure film

    The product is semi-cured by coating the acrylic/epoxy resin adhesive on the carrier.
    Description
    Product description

    The product is semi-cured by coating the acrylic/epoxy resin adhesive on the carrier. According to the thickness of the applied adhesive layer, a variety of products with different specifications can be produced.

    It is used as an intermediate bonding layer when reinforcing and laminating multi-layer circuit boards. It has good temperature resistance and peel strength, which is convenient for operation.

    Product specification

    Thickness: 12.5um, 25um, 35um, 40±3um

    Width: 250mm, 500mm

    Length: 200m

    Product structure
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