QFN high temperature tape for packaging

Product description

QFN packaging high temperature tape, also known as QFN lead frame tape, is used in QFN or SON MAP packaging. It is attached to the back of the lead frame before packaging to prevent the formation of burrs during the plastic packaging process and improve the wire bond yield.

The product combines the company's advanced bonding control technology and heat-resistant substrates and adhesives, and is applied to various chip packaging and other electronic components and devices with high temperature protection technology. The silicone series has a variety of excellent heat resistance properties and can be used in the heating process. The temporary fixation and shielding can be used for the production flow between the protection processes of thin film elements. The adhesive can be selected from acrylic-based adhesives, silicon-based adhesives and hot-melt glues. It is suitable for heating applications, has no residual glue, and has no offset printing, meeting customer requirements. Product specifications

Product structure

Silicone/Acrylic QFN Tape

Hot-pressed QFN tape